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H1 renamed PCB layers

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This commit is contained in:
Michael Ossmann
2014-02-13 15:36:05 -07:00
parent e78a3f9edc
commit ad0bceb798
2 changed files with 10 additions and 10 deletions
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9
hardware/hackrf-one/README
View File

@ -26,10 +26,10 @@ Schematic and layout files were designed in KiCad, an open source electronic
design automation package.
order of copper layers:
Copper 1: Front
Copper 2: Inner3
Copper 3: Inner2
Copper 4: Back
Copper 1: C1F (front)
Copper 2: C2
Copper 3: C3
Copper 4: C1B (back)
PCB description: 4 layer PCB 0.062 in
Copper 1 0.5 oz foil plated to approximately 0.0017 in
@ -39,6 +39,7 @@ PCB description: 4 layer PCB 0.062 in
Copper 3 1 oz foil (0.0014 in)
Dielectric 3-4 0.0119 in
Copper 4 0.5 oz foil plated to approximately 0.0017 in
FR4 or similar substrate with Er=4.5 (+/- 0.1)
double side solder mask green
single side silkscreen white

11
hardware/hackrf-one/hackrf-one.brd
View File

@ -1,4 +1,4 @@
PCBNEW-BOARD Version 2 date Thu Feb 13 12:26:19 2014
PCBNEW-BOARD Version 2 date Thu Feb 13 15:33:30 2014
# Created by Pcbnew(2013-07-24 BZR 4024)-stable
@ -7,7 +7,6 @@ encoding utf-8
Units mm
LayerCount 4
EnabledLayers 12FF8007
VisibleLayers 12FF8001
Links 1221
NoConn 0
Di 56.518289 17.0375 275.101601 175.693733
@ -33,10 +32,10 @@ $EndSHEETDESCR
$SETUP
Layers 4
Layer[0] Back signal
Layer[1] Inner2 signal
Layer[2] Inner3 signal
Layer[15] Front signal
Layer[0] C4B signal
Layer[1] C3 signal
Layer[2] C2 signal
Layer[15] C1F signal
TrackWidth 0.2794
TrackWidthList 0.1524
TrackWidthList 0.2032