diff --git a/hardware/hackrf-one/README b/hardware/hackrf-one/README
index 8ba473dd..c8515f65 100644
--- a/hardware/hackrf-one/README
+++ b/hardware/hackrf-one/README
@@ -26,10 +26,10 @@ Schematic and layout files were designed in KiCad, an open source electronic
 design automation package.
 
 order of copper layers:
-    Copper 1: Front
-    Copper 2: Inner3
-    Copper 3: Inner2
-    Copper 4: Back
+    Copper 1:  C1F (front)
+    Copper 2:  C2
+    Copper 3:  C3
+    Copper 4:  C1B (back)
 
 PCB description: 4 layer PCB 0.062 in
     Copper        1   0.5 oz foil plated to approximately 0.0017 in
@@ -39,6 +39,7 @@ PCB description: 4 layer PCB 0.062 in
     Copper        3   1 oz foil (0.0014 in)
     Dielectric  3-4   0.0119 in
     Copper        4   0.5 oz foil plated to approximately 0.0017 in
+
 FR4 or similar substrate with Er=4.5 (+/- 0.1)
 double side solder mask green
 single side silkscreen white
diff --git a/hardware/hackrf-one/hackrf-one.brd b/hardware/hackrf-one/hackrf-one.brd
index e5493de3..5739dc9b 100644
--- a/hardware/hackrf-one/hackrf-one.brd
+++ b/hardware/hackrf-one/hackrf-one.brd
@@ -1,4 +1,4 @@
-PCBNEW-BOARD Version 2 date Thu Feb 13 12:26:19 2014
+PCBNEW-BOARD Version 2 date Thu Feb 13 15:33:30 2014
 
 # Created by Pcbnew(2013-07-24 BZR 4024)-stable
 
@@ -7,7 +7,6 @@ encoding utf-8
 Units mm
 LayerCount 4
 EnabledLayers 12FF8007
-VisibleLayers 12FF8001
 Links 1221
 NoConn 0
 Di 56.518289 17.0375 275.101601 175.693733
@@ -33,10 +32,10 @@ $EndSHEETDESCR
 
 $SETUP
 Layers 4
-Layer[0] Back signal
-Layer[1] Inner2 signal
-Layer[2] Inner3 signal
-Layer[15] Front signal
+Layer[0] C4B signal
+Layer[1] C3 signal
+Layer[2] C2 signal
+Layer[15] C1F signal
 TrackWidth 0.2794
 TrackWidthList 0.1524
 TrackWidthList 0.2032