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HackRF One: update PCB stack-up specification

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This commit is contained in:
Michael Ossmann
2022-08-27 10:00:07 -04:00
parent 239b28528e
commit 3d4d923841
3 changed files with 40 additions and 13 deletions
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20
hardware/hackrf-one/README
View File

@ -31,17 +31,17 @@ order of copper layers:
Copper 3: C3 Copper 3: C3
Copper 4: C4B (back) Copper 4: C4B (back)
PCB description: 4 layer PCB 0.062 in PCB description: 4 layer PCB 1.6 mm
Copper 1 0.5 oz foil plated to approximately 0.0017 in Copper 1 0.035 mm
Dielectric 1-2 0.0119 in Prepreg 1-2 0.2104 mm
Copper 2 1 oz foil (0.0014 in) Copper 2 0.0152 mm
Dielectric 2-3 0.0280 in Core 2-3 1.065 mm
Copper 3 1 oz foil (0.0014 in) Copper 3 0.0152 mm
Dielectric 3-4 0.0119 in Prepreg 3-4 0.2104 mm
Copper 4 0.5 oz foil plated to approximately 0.0017 in Copper 4 0.035 mm
FR4 or similar substrate with Er=4.5 (+/- 0.1) 7628 prepreg with Er=4.6 (+/- 0.1)
required impedance: 50 ohm (+/- 5%) 20 mil microstrip impedance required impedance: 50 ohm (+/- 5%) 11.55 mil microstrip impedance
double side solder mask green double side solder mask green
single side silkscreen white single side silkscreen white
6 mil min trace width and 6 mil min trace width and

24
hardware/hackrf-one/hackrf-one.kicad_pcb
View File

@ -1,7 +1,7 @@
(kicad_pcb (version 20211014) (generator pcbnew) (kicad_pcb (version 20211014) (generator pcbnew)
(general (general
(thickness 1.6002) (thickness 1.6116)
) )
(paper "USLegal") (paper "USLegal")
@ -29,10 +29,30 @@
(39 "F.Mask" user) (39 "F.Mask" user)
(41 "Cmts.User" user "User.Comments") (41 "Cmts.User" user "User.Comments")
(44 "Edge.Cuts" user) (44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
) )
(setup (setup
(pad_to_mask_clearance 0.0762) (stackup
(layer "F.SilkS" (type "Top Silk Screen") (color "White"))
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.0127) (material "LPI") (epsilon_r 3.8) (loss_tangent 0))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "prepreg") (thickness 0.2104) (material "7628") (epsilon_r 4.6) (loss_tangent 0))
(layer "In1.Cu" (type "copper") (thickness 0.0152))
(layer "dielectric 2" (type "core") (thickness 1.065) (material "7628") (epsilon_r 4.6) (loss_tangent 0))
(layer "In2.Cu" (type "copper") (thickness 0.0152))
(layer "dielectric 3" (type "prepreg") (thickness 0.2104) (material "7628") (epsilon_r 4.6) (loss_tangent 0))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.0127) (material "LPI") (epsilon_r 3.8) (loss_tangent 0))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen") (color "White"))
(copper_finish "ENIG")
(dielectric_constraints yes)
)
(pad_to_mask_clearance 0.05)
(pad_to_paste_clearance_ratio -0.12) (pad_to_paste_clearance_ratio -0.12)
(pcbplotparams (pcbplotparams
(layerselection 0x00010e8_ffffffff) (layerselection 0x00010e8_ffffffff)

9
hardware/hackrf-one/hackrf-one.kicad_pro
View File

@ -48,7 +48,13 @@
"min_clearance": 0.254 "min_clearance": 0.254
} }
}, },
"diff_pair_dimensions": [], "diff_pair_dimensions": [
{
"gap": 0.0,
"via_gap": 0.0,
"width": 0.0
}
],
"drc_exclusions": [], "drc_exclusions": [],
"meta": { "meta": {
"filename": "board_design_settings.json", "filename": "board_design_settings.json",
@ -116,6 +122,7 @@
0.1524, 0.1524,
0.2032, 0.2032,
0.254, 0.254,
0.29337,
0.3048, 0.3048,
0.4064, 0.4064,
0.4572, 0.4572,