From 3d4d9238418d68f4ac7cb68cc4684e7a90f41051 Mon Sep 17 00:00:00 2001 From: Michael Ossmann Date: Sat, 27 Aug 2022 10:00:07 -0400 Subject: [PATCH] HackRF One: update PCB stack-up specification --- hardware/hackrf-one/README | 20 ++++++++++---------- hardware/hackrf-one/hackrf-one.kicad_pcb | 24 ++++++++++++++++++++++-- hardware/hackrf-one/hackrf-one.kicad_pro | 9 ++++++++- 3 files changed, 40 insertions(+), 13 deletions(-) diff --git a/hardware/hackrf-one/README b/hardware/hackrf-one/README index a0112d35..58a09ca6 100644 --- a/hardware/hackrf-one/README +++ b/hardware/hackrf-one/README @@ -31,17 +31,17 @@ order of copper layers: Copper 3: C3 Copper 4: C4B (back) -PCB description: 4 layer PCB 0.062 in - Copper 1 0.5 oz foil plated to approximately 0.0017 in - Dielectric 1-2 0.0119 in - Copper 2 1 oz foil (0.0014 in) - Dielectric 2-3 0.0280 in - Copper 3 1 oz foil (0.0014 in) - Dielectric 3-4 0.0119 in - Copper 4 0.5 oz foil plated to approximately 0.0017 in +PCB description: 4 layer PCB 1.6 mm + Copper 1 0.035 mm + Prepreg 1-2 0.2104 mm + Copper 2 0.0152 mm + Core 2-3 1.065 mm + Copper 3 0.0152 mm + Prepreg 3-4 0.2104 mm + Copper 4 0.035 mm -FR4 or similar substrate with Er=4.5 (+/- 0.1) -required impedance: 50 ohm (+/- 5%) 20 mil microstrip impedance +7628 prepreg with Er=4.6 (+/- 0.1) +required impedance: 50 ohm (+/- 5%) 11.55 mil microstrip impedance double side solder mask green single side silkscreen white 6 mil min trace width and diff --git a/hardware/hackrf-one/hackrf-one.kicad_pcb b/hardware/hackrf-one/hackrf-one.kicad_pcb index e592aa1b..d56c4008 100644 --- a/hardware/hackrf-one/hackrf-one.kicad_pcb +++ b/hardware/hackrf-one/hackrf-one.kicad_pcb @@ -1,7 +1,7 @@ (kicad_pcb (version 20211014) (generator pcbnew) (general - (thickness 1.6002) + (thickness 1.6116) ) (paper "USLegal") @@ -29,10 +29,30 @@ (39 "F.Mask" user) (41 "Cmts.User" user "User.Comments") (44 "Edge.Cuts" user) + (45 "Margin" user) + (46 "B.CrtYd" user "B.Courtyard") + (47 "F.CrtYd" user "F.Courtyard") ) (setup - (pad_to_mask_clearance 0.0762) + (stackup + (layer "F.SilkS" (type "Top Silk Screen") (color "White")) + (layer "F.Paste" (type "Top Solder Paste")) + (layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.0127) (material "LPI") (epsilon_r 3.8) (loss_tangent 0)) + (layer "F.Cu" (type "copper") (thickness 0.035)) + (layer "dielectric 1" (type "prepreg") (thickness 0.2104) (material "7628") (epsilon_r 4.6) (loss_tangent 0)) + (layer "In1.Cu" (type "copper") (thickness 0.0152)) + (layer "dielectric 2" (type "core") (thickness 1.065) (material "7628") (epsilon_r 4.6) (loss_tangent 0)) + (layer "In2.Cu" (type "copper") (thickness 0.0152)) + (layer "dielectric 3" (type "prepreg") (thickness 0.2104) (material "7628") (epsilon_r 4.6) (loss_tangent 0)) + (layer "B.Cu" (type "copper") (thickness 0.035)) + (layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.0127) (material "LPI") (epsilon_r 3.8) (loss_tangent 0)) + (layer "B.Paste" (type "Bottom Solder Paste")) + (layer "B.SilkS" (type "Bottom Silk Screen") (color "White")) + (copper_finish "ENIG") + (dielectric_constraints yes) + ) + (pad_to_mask_clearance 0.05) (pad_to_paste_clearance_ratio -0.12) (pcbplotparams (layerselection 0x00010e8_ffffffff) diff --git a/hardware/hackrf-one/hackrf-one.kicad_pro b/hardware/hackrf-one/hackrf-one.kicad_pro index 071d2bec..c4645c4a 100644 --- a/hardware/hackrf-one/hackrf-one.kicad_pro +++ b/hardware/hackrf-one/hackrf-one.kicad_pro @@ -48,7 +48,13 @@ "min_clearance": 0.254 } }, - "diff_pair_dimensions": [], + "diff_pair_dimensions": [ + { + "gap": 0.0, + "via_gap": 0.0, + "width": 0.0 + } + ], "drc_exclusions": [], "meta": { "filename": "board_design_settings.json", @@ -116,6 +122,7 @@ 0.1524, 0.2032, 0.254, + 0.29337, 0.3048, 0.4064, 0.4572,