2012-11-11 11:44:44 -07:00

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order of copper layers:
Copper 1: Front
Copper 2: Inner3
Copper 3: Inner2
Copper 4: Back
PCB description: 4 layer PCB 0.062 in
Copper 1 0.5 oz foil plated to approximately 0.0017 in
Dielectric 1-2 0.0119 in
Copper 2 1 oz foil (0.0014 in)
Dielectric 2-3 0.0280 in
Copper 3 1 oz foil (0.0014 in)
Dielectric 3-4 0.0119 in
Copper 4 0.5 oz foil plated to approximately 0.0017 in
FR4 or similar substrate with Er=4.5 (+/- 0.1)
double side solder mask black
single side silkscreen white
6 mil min trace width and
6 mil min isolation