hackrf/hardware/LNA915/LNA915.pretty/SMA-KIT-1.5MF.kicad_mod
Michael Ossmann 8e310bdf63 LNA915: redesign around GRF6011 failsafe switch
fits in SMA-KIT-1.5MF inline SMA enclosure
2020-06-22 22:35:52 -06:00

34 lines
2.2 KiB
Plaintext

(module SMA-KIT-1.5MF (layer F.Cu) (tedit 5EF0C477)
(fp_text reference REF** (at 1.27 -1.27) (layer F.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.12446)))
)
(fp_text value SMA-KIT-1.5MF (at 1.99898 4.0005) (layer F.Fab)
(effects (font (size 0.50038 0.50038) (thickness 0.12446)))
)
(fp_text user %R (at 1.27 0) (layer F.Fab)
(effects (font (size 0.50038 0.50038) (thickness 0.12446)))
)
(pad 2 smd rect (at 0.5 3.135) (size 1 2.7) (layers F.Cu F.Mask))
(pad 2 smd rect (at 0.5 -3.135) (size 1 2.7) (layers B.Cu B.Mask))
(pad 2 smd rect (at 0.5 3.135) (size 1 2.7) (layers B.Cu B.Mask))
(pad 2 smd rect (at 0.5 -3.135) (size 1 2.7) (layers F.Cu F.Mask))
(pad 1 smd rect (at 0.5 0) (size 1 1.524) (layers F.Cu F.Mask))
(pad 2 thru_hole circle (at 0.6 -2.2) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.6 -2.9) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.6 -3.6) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.6 2.2) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.6 2.9) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.6 3.6) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 thru_hole circle (at 11.39 -3.6 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 smd rect (at 11.49 -3.135 180) (size 1 2.7) (layers B.Cu B.Mask))
(pad 3 smd rect (at 11.49 0 180) (size 1 1.524) (layers F.Cu F.Mask))
(pad 4 smd rect (at 11.49 3.135 180) (size 1 2.7) (layers F.Cu F.Mask))
(pad 4 thru_hole circle (at 11.39 2.9 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 thru_hole circle (at 11.39 -2.2 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 thru_hole circle (at 11.39 2.2 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 thru_hole circle (at 11.39 -2.9 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 smd rect (at 11.49 -3.135 180) (size 1 2.7) (layers F.Cu F.Mask))
(pad 4 thru_hole circle (at 11.39 3.6 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 smd rect (at 11.49 3.135 180) (size 1 2.7) (layers B.Cu B.Mask))
)