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HackRF One: update 100 nF capacitor part selection

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This commit is contained in:
Michael Ossmann
2023-12-06 20:04:35 -05:00
parent 3f34a678a5
commit a4e07bde83
4 changed files with 570 additions and 342 deletions
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hardware/hackrf-one/baseband.kicad_sch
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162
hardware/hackrf-one/frontend.kicad_sch
View File

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(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402" (id 6) (at 132.08 254 0) (property "Description" "CAP CER 0.1UF 25V X5R 0402" (id 6) (at 132.08 254 0)
(effects (font (size 1.524 1.524)) hide) (effects (font (size 1.524 1.524)) hide)
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(property "Substitution" "Murata GRM155R61A104KA01D" (id 7) (at 158.75 158.75 0)
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@ -8606,15 +8645,18 @@
(property "Datasheet" "" (id 3) (at 185.42 255.27 0) (property "Datasheet" "" (id 3) (at 185.42 255.27 0)
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(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402" (id 6) (at 185.42 255.27 0) (property "Description" "CAP CER 0.1UF 25V X5R 0402" (id 6) (at 185.42 255.27 0)
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@ -8652,15 +8694,18 @@
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(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402" (id 6) (at 307.34 345.44 0) (property "Description" "CAP CER 0.1UF 25V X5R 0402" (id 6) (at 307.34 345.44 0)
(effects (font (size 1.524 1.524)) hide) (effects (font (size 1.524 1.524)) hide)
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(property "Substitution" "Murata GRM155R61A104KA01D" (id 7) (at 290.83 231.14 0)
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(pin "1" (uuid 1726ead5-55b0-415f-8857-aa31e8b18841)) (pin "1" (uuid 1726ead5-55b0-415f-8857-aa31e8b18841))
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@ -8680,15 +8725,18 @@
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(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402" (id 6) (at 251.46 262.89 0) (property "Description" "CAP CER 0.1UF 25V X5R 0402" (id 6) (at 251.46 262.89 0)
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@ -8708,15 +8756,18 @@
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(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402" (id 6) (at 191.77 22.86 0) (property "Description" "CAP CER 0.1UF 25V X5R 0402" (id 6) (at 191.77 22.86 0)
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@ -8736,15 +8787,18 @@
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399
hardware/hackrf-one/hackrf-one.kicad_pcb
View File

@ -1234,11 +1234,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787dffb) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787dffb)
(at 85.4 149.1682 90) (at 85.4 149.1682 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502b53a4") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502b53a4")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -1473,11 +1474,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e043) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e043)
(at 82.9358 141.9382) (at 82.9358 141.9382)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000501f41bb") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000501f41bb")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -1502,11 +1504,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e04c) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e04c)
(at 78.8718 141.9382) (at 78.8718 141.9382)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000501f41b9") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000501f41b9")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -1561,11 +1564,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e05e) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e05e)
(at 87.8078 141.5288) (at 87.8078 141.5288)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000501f41bd") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000501f41bd")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -1650,11 +1654,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e079) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e079)
(at 101.2698 151.1808 90) (at 101.2698 151.1808 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502b4c6f") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502b4c6f")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -1709,11 +1714,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e08b) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e08b)
(at 97.1924 163.7326) (at 97.1924 163.7326)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000503bb2bd") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000503bb2bd")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -1798,11 +1804,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e0a6) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e0a6)
(at 97.1924 164.8756) (at 97.1924 164.8756)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502b477a") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502b477a")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -1887,11 +1894,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e0c1) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e0c1)
(at 75.5952 142.4462 90) (at 75.5952 142.4462 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502b56c2") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502b56c2")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -2276,11 +2284,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e136) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e136)
(at 79.6798 149.4282 90) (at 79.6798 149.4282 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000501f4169") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000501f4169")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -2335,11 +2344,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e148) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e148)
(at 103.0478 156.7942 180) (at 103.0478 156.7942 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502b4c15") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502b4c15")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -2424,11 +2434,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e163) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e163)
(at 100.85 156.2396 -90) (at 100.85 156.2396 -90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000503bb2ce") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000503bb2ce")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -2453,11 +2464,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e16c) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e16c)
(at 75.678 152.92) (at 75.678 152.92)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000528ea90e") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000528ea90e")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -2692,11 +2704,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e1b4) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e1b4)
(at 71.614 157.111 90) (at 71.614 157.111 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000528ea8de") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000528ea8de")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -2721,11 +2734,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e1bd) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e1bd)
(at 79.742 155.714) (at 79.742 155.714)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000528ea93e") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000528ea93e")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -2780,11 +2794,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e1cf) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e1cf)
(at 76.3638 156.3236 90) (at 76.3638 156.3236 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502e6909") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502e6909")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -2809,11 +2824,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e1d8) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e1d8)
(at 75.551 160.032) (at 75.551 160.032)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000528ea96e") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000528ea96e")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -2868,11 +2884,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e1ea) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e1ea)
(at 71.13 160.81 180) (at 71.13 160.81 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502c6d4a") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-0000502c6d4a")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -3079,11 +3096,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e229) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e229)
(at 100.4824 118.5578 -90) (at 100.4824 118.5578 -90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49df") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49df")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -3137,11 +3155,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e23b) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e23b)
(at 103.4034 118.5578 -90) (at 103.4034 118.5578 -90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49f2") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49f2")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -3195,11 +3214,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e24d) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e24d)
(at 105.4354 118.5578 -90) (at 105.4354 118.5578 -90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49f4") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49f4")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -3253,11 +3273,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e25f) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e25f)
(at 101.6254 106.3658 90) (at 101.6254 106.3658 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49f7") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49f7")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -3311,11 +3332,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e271) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e271)
(at 96.7359 110.4933 180) (at 96.7359 110.4933 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49f8") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49f8")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -3369,11 +3391,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e283) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e283)
(at 96.1009 113.1603 180) (at 96.1009 113.1603 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49fa") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49fa")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -3427,11 +3450,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e295) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e295)
(at 96.3549 115.3193 180) (at 96.3549 115.3193 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49fb") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49fb")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -3666,11 +3690,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e2dd) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e2dd)
(at 110.9345 136.3091 90) (at 110.9345 136.3091 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c4b4a") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c4b4a")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4331,11 +4356,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3a3) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3a3)
(at 123.1512 165.466 -90) (at 123.1512 165.466 -90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49a8") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49a8")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4479,11 +4505,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3d0) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3d0)
(at 129.2472 158.481 90) (at 129.2472 158.481 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49af") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49af")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4508,11 +4535,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3d9) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3d9)
(at 131.628 160.6236 90) (at 131.628 160.6236 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49cc") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49cc")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4537,11 +4565,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3e2) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3e2)
(at 122.0268 162.7064 180) (at 122.0268 162.7064 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49cd") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49cd")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4566,11 +4595,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3eb) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3eb)
(at 125.8368 158.3122 180) (at 125.8368 158.3122 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49ce") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49ce")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4595,11 +4625,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3f4) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e3f4)
(at 108.9914 113.0587) (at 108.9914 113.0587)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49d3") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-0000503c49d3")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4743,11 +4774,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e421) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e421)
(at 150.84628 123.279349 135) (at 150.84628 123.279349 135)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4be3") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4be3")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4772,11 +4804,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e42a) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e42a)
(at 143.931482 125.344808 135) (at 143.931482 125.344808 135)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c12") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c12")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4801,11 +4834,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e433) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e433)
(at 137.555501 131.72079 135) (at 137.555501 131.72079 135)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c1c") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c1c")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4830,11 +4864,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e43c) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e43c)
(at 132.898 137.0016 180) (at 132.898 137.0016 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c1d") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c1d")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4859,11 +4894,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e445) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e445)
(at 134.4982 145.7138 -135) (at 134.4982 145.7138 -135)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c1e") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c1e")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4888,11 +4924,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e44e) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e44e)
(at 140.429183 151.477353 -135) (at 140.429183 151.477353 -135)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c1f") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c1f")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4917,11 +4954,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e457) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e457)
(at 145.009113 156.057284 -135) (at 145.009113 156.057284 -135)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c21") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c21")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4946,11 +4984,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e460) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e460)
(at 153.809764 155.698074 -45) (at 153.809764 155.698074 -45)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c23") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c23")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -4975,11 +5014,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e469) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e469)
(at 159.467325 150.040512 -45) (at 159.467325 150.040512 -45)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c24") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c24")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5004,11 +5044,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e472) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e472)
(at 160.904166 148.603671 -45) (at 160.904166 148.603671 -45)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c25") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c25")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5033,11 +5074,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e47b) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e47b)
(at 162.969625 146.538212 -45) (at 162.969625 146.538212 -45)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c27") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c27")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5062,11 +5104,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e484) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e484)
(at 164.406466 145.101371 -45) (at 164.406466 145.101371 -45)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c28") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c28")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5091,11 +5134,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e48d) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e48d)
(at 164.945282 136.480325 -45) (at 164.945282 136.480325 -45)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c29") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c29")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5120,11 +5164,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e496) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e496)
(at 157.312064 127.589872 45) (at 157.312064 127.589872 45)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c2a") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c2a")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5149,11 +5194,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e49f) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e49f)
(at 160.095943 130.553356 45) (at 160.095943 130.553356 45)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c2c") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c2c")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5208,11 +5254,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4b1) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4b1)
(at 153.6192 160.5788 180) (at 153.6192 160.5788 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c30") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c30")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5297,11 +5344,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4cc) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4cc)
(at 172.832 112.0782 -90) (at 172.832 112.0782 -90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4b67") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4b67")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5326,11 +5374,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4d5) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4d5)
(at 137.668 118.1608 -90) (at 137.668 118.1608 -90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c68") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c68")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5355,11 +5404,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4de) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4de)
(at 138.5876 111.7032) (at 138.5876 111.7032)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c67") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c67")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5384,11 +5434,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4e7) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4e7)
(at 130.81 105.5878 90) (at 130.81 105.5878 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c65") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c65")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5413,11 +5464,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4f9) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e4f9)
(at 124.4144 128.01) (at 124.4144 128.01)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c63") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c63")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5442,11 +5494,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e502) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e502)
(at 114.554 117.0178 180) (at 114.554 117.0178 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c62") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c62")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5471,11 +5524,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e50b) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e50b)
(at 118.4962 126.6892 180) (at 118.4962 126.6892 180)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
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(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c50") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c50")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5830,11 +5884,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e577) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e577)
(at 119.7154 166.1354 -90) (at 119.7154 166.1354 -90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "frontend.kicad_sch") (property "Sheetfile" "frontend.kicad_sch")
(property "Sheetname" "frontend") (property "Sheetname" "frontend")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-00005281bf94") (path "/00000000-0000-0000-0000-0000503bb638/00000000-0000-0000-0000-00005281bf94")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -5859,11 +5914,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e580) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005787e580)
(at 81.7932 120.1106 -90) (at 81.7932 120.1106 -90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "baseband.kicad_sch") (property "Sheetfile" "baseband.kicad_sch")
(property "Sheetname" "baseband") (property "Sheetname" "baseband")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-00005281b72f") (path "/00000000-0000-0000-0000-000050370666/00000000-0000-0000-0000-00005281b72f")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)
@ -14023,11 +14079,12 @@
(footprint "hackrf:GSG-0402" (layer "F.Cu") (footprint "hackrf:GSG-0402" (layer "F.Cu")
(tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005f04fc81) (tedit 4FB6CFE4) (tstamp 00000000-0000-0000-0000-00005f04fc81)
(at 117.094 108.3818 90) (at 117.094 108.3818 90)
(property "Description" "CAP CER 0.1UF 10V 10% X5R 0402") (property "Description" "CAP CER 0.1UF 25V X5R 0402")
(property "Manufacturer" "Murata") (property "Manufacturer" "Samsung")
(property "Part Number" "GRM155R61A104KA01D") (property "Part Number" "CL05A104KA5NNNC")
(property "Sheetfile" "mcu.kicad_sch") (property "Sheetfile" "mcu.kicad_sch")
(property "Sheetname" "mcu/usb/power") (property "Sheetname" "mcu/usb/power")
(property "Substitution" "Murata GRM155R61A104KA01D")
(path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c64") (path "/00000000-0000-0000-0000-00005037043e/00000000-0000-0000-0000-0000503c4c64")
(solder_mask_margin 0.1016) (solder_mask_margin 0.1016)
(attr through_hole) (attr through_hole)

216
hardware/hackrf-one/mcu.kicad_sch
View File

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