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LNA915: modify SMA-KIT-1.5MF footprint to ease soldering

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Michael Ossmann
2020-08-03 10:54:03 -06:00
parent 3bcb11fc12
commit 6e4f738c6c
1 changed files with 30 additions and 29 deletions
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59
hardware/LNA915/LNA915.pretty/SMA-KIT-1.5MF.kicad_mod
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@ -1,33 +1,34 @@
(module SMA-KIT-1.5MF (layer F.Cu) (tedit 5EF0C477) (module SMA-KIT-1.5MF (layer F.Cu) (tedit 5F26EE20)
(fp_text reference REF** (at 1.27 -1.27) (layer F.SilkS) (attr virtual)
(effects (font (size 0.50038 0.50038) (thickness 0.12446))) (fp_text reference REF** (at 0 -5.2) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text value SMA-KIT-1.5MF (at 1.99898 4.0005) (layer F.Fab) (fp_text value SMA-KIT-1.5MF (at 0 5.2) (layer F.Fab)
(effects (font (size 0.50038 0.50038) (thickness 0.12446))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text user %R (at 1.27 0) (layer F.Fab) (fp_text user %R (at 1 -1.3) (layer F.Fab)
(effects (font (size 0.50038 0.50038) (thickness 0.12446))) (effects (font (size 0.5 0.5) (thickness 0.075)))
) )
(pad 2 smd rect (at 0.5 3.135) (size 1 2.7) (layers F.Cu F.Mask)) (pad 2 smd rect (at 0.5 3.185) (size 1 2.6) (layers F.Cu F.Mask))
(pad 2 smd rect (at 0.5 -3.135) (size 1 2.7) (layers B.Cu B.Mask)) (pad 2 smd rect (at 0.5 -3.185) (size 1 2.6) (layers B.Cu B.Mask))
(pad 2 smd rect (at 0.5 3.135) (size 1 2.7) (layers B.Cu B.Mask)) (pad 2 smd rect (at 0.5 3.185) (size 1 2.6) (layers B.Cu B.Mask))
(pad 2 smd rect (at 0.5 -3.135) (size 1 2.7) (layers F.Cu F.Mask)) (pad 2 smd rect (at 0.5 -3.185) (size 1 2.6) (layers F.Cu F.Mask))
(pad 1 smd rect (at 0.5 0) (size 1 1.524) (layers F.Cu F.Mask)) (pad 1 smd rect (at 0.75 0) (size 1.5 1.6) (layers F.Cu F.Mask))
(pad 2 thru_hole circle (at 0.6 -2.2) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 2 thru_hole circle (at 0.6 -2.3) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.6 -2.9) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 2 thru_hole circle (at 0.6 -3) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.6 -3.6) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 2 thru_hole circle (at 0.6 -3.7) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.6 2.2) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 2 thru_hole circle (at 0.6 2.3) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.6 2.9) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 2 thru_hole circle (at 0.6 3) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.6 3.6) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 2 thru_hole circle (at 0.6 3.7) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 thru_hole circle (at 11.39 -3.6 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 4 thru_hole circle (at 11.39 -3.7 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 smd rect (at 11.49 -3.135 180) (size 1 2.7) (layers B.Cu B.Mask)) (pad 4 smd rect (at 11.49 -3.185 180) (size 1 2.6) (layers B.Cu B.Mask))
(pad 3 smd rect (at 11.49 0 180) (size 1 1.524) (layers F.Cu F.Mask)) (pad 3 smd rect (at 11.24 0 180) (size 1.5 1.6) (layers F.Cu F.Mask))
(pad 4 smd rect (at 11.49 3.135 180) (size 1 2.7) (layers F.Cu F.Mask)) (pad 4 smd rect (at 11.49 3.185 180) (size 1 2.6) (layers F.Cu F.Mask))
(pad 4 thru_hole circle (at 11.39 2.9 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 4 thru_hole circle (at 11.39 3 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 thru_hole circle (at 11.39 -2.2 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 4 thru_hole circle (at 11.39 -2.3 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 thru_hole circle (at 11.39 2.2 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 4 thru_hole circle (at 11.39 2.3 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 thru_hole circle (at 11.39 -2.9 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 4 thru_hole circle (at 11.39 -3 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 smd rect (at 11.49 -3.135 180) (size 1 2.7) (layers F.Cu F.Mask)) (pad 4 smd rect (at 11.49 -3.185 180) (size 1 2.6) (layers F.Cu F.Mask))
(pad 4 thru_hole circle (at 11.39 3.6 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask)) (pad 4 thru_hole circle (at 11.39 3.7 180) (size 0.64 0.64) (drill 0.3) (layers *.Cu *.Mask))
(pad 4 smd rect (at 11.49 3.135 180) (size 1 2.7) (layers B.Cu B.Mask)) (pad 4 smd rect (at 11.49 3.185 180) (size 1 2.6) (layers B.Cu B.Mask))
) )